AD829

REV. E

–12–

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

Cerdip (Q) Package

0.320 (8.13)

0.290 (7.37)

0.015 (0.38)

0.008 (0.20)

15

°

0

°

0.005 (0.13) MIN

0.055 (1.40) MAX

1

PIN 1

4

5

8

0.310 (7.87)

0.220 (5.59)

0.405 (10.29) MAX

0.200

(5.08)

MAX

SEATING

PLANE

0.023 (0.58)

0.014 (0.36)

0.070 (1.78)

0.030 (0.76)

0.060 (1.52)

0.015 (0.38)

0.150

(3.81)

MIN

0.200 (5.08)

0.125 (3.18)

0.100

(2.54)

BSC

Plastic Mini-DIP (N) Package

0.011±0.003

(0.28±0.08)

0.30 (7.62)

REF

15

°

0

°

PIN 1

4

5

8

1

0.25

(6.35)

0.31

(7.87)

0.10

(2.54)

BSC

SEATING

PLANE

0.035±0.01

(0.89±0.25)

0.18±0.03

(4.57±0.76)

0.033

(0.84)

NOM

0.018±0.003

(0.46±0.08)

0.125

(3.18)

MIN

0.165±0.01

(4.19±0.25)

0.39 (9.91) MAX

8-Lead SOIC (R) Package

85

4

1

0.1968 (5.00)

0.1890 (4.80)

0.2440 (6.20)

0.2284 (5.80)

PIN 1

0.1574 (4.00)

0.1497 (3.80)

0.0500 (1.27)

BSC

0.0688 (1.75)

0.0532 (1.35)

SEATING

PLANE

0.0098 (0.25)

0.0040 (0.10)

0.0192 (0.49)

0.0138 (0.35)

0.0098 (0.25)

0.0075 (0.19)

0.0500 (1.27)

0.0160 (0.41)

8

0

0.0196 (0.50)

0.0099 (0.25)

45

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20-Lead LCC (E-20A) Package

1

20

4

9

8

13

19

BOTTOM

VIEW

14

3

18

0.028 (0.71)

0.022 (0.56)

45° TYP

0.015 (0.38)

MIN

0.055 (1.40)

0.045 (1.14)

0.050 (1.27)

BSC

0.075 (1.91)

REF

0.011 (0.28)

0.007 (0.18)

R TYP

0.095 (2.41)

0.075 (1.90)

0.100 (2.54) BSC

0.200 (5.08)

BSC

0.150 (3.81)

BSC

0.075

(1.91)

REF

0.358 (9.09)

0.342 (8.69)

SQ

0.358

(9.09)

MAX

SQ

0.100 (2.54)

0.064 (1.63)

0.088 (2.24)

0.054 (1.37)