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AO4606 Fiches technique(PDF) 2 Page - Alpha & Omega Semiconductors |
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AO4606 Fiches technique(HTML) 2 Page - Alpha & Omega Semiconductors |
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2 / 9 page ![]() AO4606 Symbol Min Typ Max Units BVDSS 30 V VDS=30V, VGS=0V 1 TJ=55°C 5 IGSS ±100 nA VGS(th) Gate Threshold Voltage 1.2 1.8 2.4 V ID(ON) 30 A 25 30 TJ=125°C 40 48 33.5 42 m Ω gFS 15 S VSD 0.76 1 V IS 2.5 A Ciss 200 255 310 pF Coss 30 45 60 pF Crss 20 35 50 pF Rg 1.6 3.25 4.9 Ω Qg(10V) 4 5.2 6 nC Qg(4.5V) 2 2.55 3 nC Qgs 0.85 nC Qgd 1.3 nC tD(on) 4.5 ns tr 2.5 ns tD(off) 14.5 ns N-Channel Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions Drain-Source Breakdown Voltage VGS=4.5V, ID=5A RDS(ON) Static Drain-Source On-Resistance IDSS VGS=0V, VDS=15V, f=1MHz SWITCHING PARAMETERS µA VDS=VGS ID=250µA VDS=0V, VGS=±20V Zero Gate Voltage Drain Current Gate-Body leakage current Gate resistance VGS=0V, VDS=0V, f=1MHz ID=250µA, VGS=0V m Ω On state drain current IS=1A,VGS=0V VDS=5V, ID=6A Forward Transconductance Diode Forward Voltage VGS=10V, VDS=5V VGS=10V, ID=6A Reverse Transfer Capacitance Total Gate Charge VGS=10V, VDS=15V, ID=6A Gate Source Charge Gate Drain Charge Total Gate Charge Maximum Body-Diode Continuous Current Input Capacitance Output Capacitance Turn-On DelayTime DYNAMIC PARAMETERS Turn-On Rise Time Turn-Off DelayTime VGS=10V, VDS=15V, RL=2.5Ω, RGEN=3Ω tD(off) 14.5 ns tf 3.5 ns trr 8.5 12 ns Qrr 2.2 3 nC THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Body Diode Reverse Recovery Time IF=6A, dI/dt=100A/µs Turn-Off Fall Time Body Diode Reverse Recovery Charge IF=6A, dI/dt=100A/µs Turn-Off DelayTime RGEN=3Ω A. The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. B. The power dissipation P D is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature T J(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initialT J=25°C. D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating. Rev 10: April 2012 www.aosmd.com Page 2 of 9 |
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