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DCPL-WB-00C2 Fiches technique(PDF) 1 Page - STMicroelectronics

No de pièce DCPL-WB-00C2
Description  Wide-band, dual-path directional coupler with ISO port
PDF  11 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

DCPL-WB-00C2 Fiches technique(HTML) 1 Page - STMicroelectronics

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October 2010
Doc ID 17994 Rev 1
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DCPL-WB-00C2
Wide-band, dual-path directional coupler with ISO port
Features
■ 50
Ω nominal input / output impedance
■ wide operating frequency range:
– 824 MHz-2170 MHz
■ low insertion loss (< 0.2 dB)
■ 37 dB typical coupling factor
■ high directivity (> 20 dB)
■ high ESD ruggedness
■ lead-free CSP package
■ Flip-Chip package
■ small footprint: 1700 x 1850 µm
■ very low profile (< 670 µm thickness)
Benefits
■ high RF performance
■ RF module size reduction
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Multi-band equipment such as:
■ power amplifier module
■ front end module
■ GSM/WCDMA mobile phone
Figure 1.
Pin configuration (bump view)
Description
The DCPL-WB-00C2 is a wide-band, dual-path
directional coupler designed to measure cell
phone transmission output power in
GSM/WCDMA applications. This dual-path CPL
has been customized for wide-band operating
frequencies (EGSM and CELL, PCS, DCS,
WCDMA band I) with less than 0.2 dB insertion
losses in the transmission bandwidth (824 MHz -
1980 MHz).
This device is built with two different RF couplers
(one dedicated to LB, the other dedicated to HB)
sharing the same coupled and isolated ports.The
DCPL-WB-00C2 has been designed using
STMicroelectronics IPD (integrated passive
device) technology on non-conductive glass
substrate to optimize RF performance.
The device is delivered 100% tested in tape and
reel.
Lead-free Flip Chip (8 bumps)
LB Path
HB Path
A1
A2
A3
C1
C2
C3
B1
B3
www.st.com


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