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54AC74 Fiches technique(PDF) 14 Page - STMicroelectronics |
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54AC74 Fiches technique(HTML) 14 Page - STMicroelectronics |
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14 / 28 page ![]() Package mechanical data 54ACxxxx, 54ACTxxxx 14/28 Doc ID 17352 Rev 3 Figure 5. Ceramic DIL-16 package outline Note: The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package. Connecting unused pins or metal lid to ground or to the power supply will not affect the electrical characteristics. Option pin 1 index mark Option leads shape Table 9. Ceramic DIL-16 package mechanical data Symbol Dimensions (mm) Min. Typ. Max. A 2.10 2.71 a1 3.00 3.70 a2 0.63 0.88 1.14 B 1.82 2.39 b 0.40 0.45 0.50 b1 0.20 0.254 0.30 D 20.06 20.32 20.58 E 7.36 7.62 7.87 e 2.54 e1 17.65 17.78 17.90 e2 7.62 7.87 8.12 F 7.29 7.49 7.70 I 3.83 K 10.90 12.10 L 1.14 1.50 |
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