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TLE4261 Fiches technique(PDF) 18 Page - Siemens Semiconductor Group |
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TLE4261 Fiches technique(HTML) 18 Page - Siemens Semiconductor Group |
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18 / 18 page ![]() TLE 4261 Semiconductor Group 18 1998-11-01 Package Outlines (cont’d) 110 11 20 Index Marking 1) Does not include plastic or metal protrusions of 0.15 max per side 2) Does not include dambar protrusion of 0.05 max per side GPS05094 0.1 +0.15 0.35 1.27 2) 0.2 24x -0.2 7.6 1) 0.35 x 45˚ +0.8 ±0.3 10.3 0.4 12.8-0.2 1) P-DSO-20-6 (Plastic Dual Small Outline) Weight approx. 0.6 g Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information”. Dimensions in mm SMD = Surface Mounted Device |
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