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TLE4206 Fiches technique(PDF) 13 Page - Siemens Semiconductor Group |
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TLE4206 Fiches technique(HTML) 13 Page - Siemens Semiconductor Group |
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13 / 14 page ![]() TLE 4206 Semiconductor Group 13 1998-02-01 Package Outlines P-DSO-14-4 (Plastic Dual Small Outline Package) 1.27 17 8.75 -0.2 14 8 6 ±0.2 0.35 x 45˚ -0.2 4 0.1 0.4 +0.8 Index Marking 1) +0.15 0.35 2) 2) Does not include dambar protrusion of 0.05 max. per side 1) Does not include plastic or metal protrusion of 0.15 max. per side 0.2 14x 1) GPS05093 Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information”. Dimensions in mm SMD = Surface Mounted Device |
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