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RF Device Data

Freescale Semiconductor, Inc.

AFT09MS031NR1 AFT09MS031GNR1

PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS

Refer to the following documents, software and tools to aid your design process.

Application Notes

• AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages

• AN1955: Thermal Measurement Methodology of RF Power Amplifiers

• AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages

• AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages

Engineering Bulletins

• EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

• Electromigration MTTF Calculator

• RF High Power Model

• .s2p File

Development Tools

• Printed Circuit Boards

For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the

Software & Tools tab on the part’s Product Summary page to download the respective tool.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

May 2012

• Initial Release of Data Sheet