ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

© Diodes Incorporated

U-DFN3030-8

Type E

Dimensions

Value (in mm)

C

0.65

C1

2.35

X

0.30

Y

0.65

Y1

1.60

Y2

2.75

U-DFN3030-10

U-DFN3030-12

Dimensions Value (in mm)

Z

2.60

G

0.15

X

1.80

X1

0.60

Y

0.30

C

0.50

Dimensions Value (in mm)

Z

2.60

G

0.15

X

1.80

X1

0.60

Y

0.28

C

0.45

U-DFN3030-14

Dimensions

Value

(in mm)

C

0.400

X

0.250

X1

2.350

X2

2.650

Y

0.600

Y1

1.750

Y2

3.400

Y

(x8)

X (x8)

C

C1

Y1

Y2

C

Y

Z

X

X1

G

G

C

Y

Z

X

X1

G

G

Pin1

X2

X1

Y1

C

X (14x)

Y2

Y (14x)