ADP7104ARDZ-5.0-R7 datasheet(23/28 Pages) AD

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ADP7104ARDZ-5.0-R7 Fiches technique(PDF) 23 Page - Analog Devices

23 / 28 page

Data Sheet

ADP7104

Rev. B | Page 23 of 28

PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP7104.

However, as listed in Table 6, a point of diminishing returns

is eventually reached, beyond which an increase in the copper

size does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0805 or 0603 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

Figure 78. Example LFCSP PCB Layout

Figure 79. Example SOIC PCB Layout

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