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ADRF6516ACPZ-R7 Fiches technique(PDF) 29 Page - Analog Devices |
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ADRF6516ACPZ-R7 Fiches technique(HTML) 29 Page - Analog Devices |
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29 / 32 page ![]() Data Sheet ADRF6516 Rev. B | Page 29 of 32 OUTLINE DIMENSIONS 3.25 3.10 SQ 2.95 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2 1 32 8 9 25 24 17 16 COPLANARITY 0.08 3.50 REF 0.50 BSC PIN 1 INDICATOR PIN 1 INDICATOR 0.30 0.25 0.18 0.20 REF 12° MAX 0.80 MAX 0.65 TYP 1.00 0.85 0.80 0.05 MAX 0.02 NOM SEATING PLANE 0.50 0.40 0.30 5.00 BSC SQ 4.75 BSC SQ 0.60 MAX 0.60 MAX 0.25 MIN TOP VIEW EXPOSED PAD BOTTOM VIEW Figure 62. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 5 mm × 5 mm Body, Very Thin Quad (CP-32-2) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option ADRF6516ACPZ-R7 −40°C to +85°C 32-Lead LFCSP_VQ, 7”Tape and Reel CP-32-2 ADRF6516-EVALZ Evaluation Board 1 Z = RoHS Compliant Part. |
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