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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ADP223ACPZ-R7 Fiches technique(PDF) 22 Page - Analog Devices |
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ADP223ACPZ-R7 Fiches technique(HTML) 22 Page - Analog Devices |
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22 / 24 page  ADP222/ADP223/ADP224/ADP225 Data Sheet Rev. B | Page 22 of 24 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP222/ADP223/ADP224/ADP225. However, as listed in Table 6, a point of diminishing returns is eventually reached beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUTx and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. U1 J1 TB2 TB5 C2 C1 C3 R3 R4 R1 R2 J2 TB6 ADP223 - ________ - EVALZ TB7 GND ANALOG DEVICES TB1 GND TB4 TB3 Figure 76. Example 8-Lead LFCSP PCB Layout |
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