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ADP1878ACPZ-0.6-R7 Fiches technique(PDF) 39 Page - Analog Devices |
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ADP1878ACPZ-0.6-R7 Fiches technique(HTML) 39 Page - Analog Devices |
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39 / 40 page ![]() Data Sheet ADP1878/ADP1879 Rev. A | Page 39 of 40 PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS Figure 96. 14-Lead Lead Frame Chip Scale Package [LFCSP_WD] 4 mm × 3 mm Body, Very Very Thin Dual (CP-14-2) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-229-WEGD BOTTOM VIEW TOP VIEW END VIEW SIDE VIEW 1 7 8 14 SEATING PLANE 0.80 0.75 0.70 0.30 0.25 0.20 0.05 MAX 0.02 NOM 0.15 REF 0.10 REF 0.90 REF 0.30 REF 0.50 BSC COPLANARITY 0.08 PIN 1 INDICATOR (LASER MARKING) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. EXPOSED PAD 0.50 0.40 0.30 1.80 1.70 1.55 3.40 3.30 3.15 3.10 3.00 2.90 4.10 4.00 3.90 0.20 MIN |
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