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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ADL5304ACPZ-R7 Fiches technique(PDF) 5 Page - Analog Devices |
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ADL5304ACPZ-R7 Fiches technique(HTML) 5 Page - Analog Devices |
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5 / 32 page  Data Sheet ADL5304 Rev. 0 | Page 5 of 32 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating VPOS +6 V VNEG −6 V Input Current to INUM, IDEN 20 mA Thermal Data, 2-Layer JEDEC Board No Air Flow (Exposed Pad Soldered to PCB) θJA 61.6°C/W θJC 1.2°C/W Maximum Power Dissipation (Exposed Pad Soldered to PC Board) 0.6 W Maximum Junction Temperature 125°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering 60 sec) 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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