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AFS090 Fiches technique(PDF) 257 Page - Microsemi Corporation |
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AFS090 Fiches technique(HTML) 257 Page - Microsemi Corporation |
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257 / 334 page ![]() Fusion Family of Mixed Signal FPGAs R e visio n 2 3 -7 Thermal Characteristics Introduction The temperature variable in the Microsemi Designer software refers to the junction temperature, not the ambient, case, or board temperatures. This is an important distinction because dynamic and static power consumption will cause the chip's junction temperature to be higher than the ambient, case, or board temperatures. EQ 1 through EQ 3 give the relationship between thermal resistance, temperature gradient, and power. EQ 1 EQ 2 EQ 3 where θJA = Junction-to-air thermal resistance θJB = Junction-to-board thermal resistance θJC = Junction-to-case thermal resistance TJ = Junction temperature TA = Ambient temperature TB = Board temperature (measured 1.0 mm away from the package edge) TC = Case temperature P = Total power dissipated by the device Table 3-6 • Package Thermal Resistance Product Die Size θ JA θ JC θ JB Units (mm) Still Air 1.0 m/s 2.5 m/s AFS090-QN108 X = 3.4; Y = 4.8 34.5 30.0 27.7 8.1 16.7 °C/W AFS090-QN180 X = 3.4; Y = 4.8 33.3 27.6 25.7 9.2 21.2 °C/W AFS250-QN180 X = 4.0; Y = 5.6 32.2 26.5 24.7 5.7 15.0 °C/W AFS250-PQ208 TBD TBD TBD TBD TBD TBD °C/W AFS600-PQ208 TBD TBD TBD TBD TBD TBD °C/W AFS090-FG256 X = 3.4; Y = 4.8 37.7 33.9 32.2 11.5 29.7 °C/W AFS250-FG256 X = 4.0; Y = 5.6 33.7 30.0 28.3 9.3 24.8 °C/W AFS600-FG256 X = 5.10; Y = 7.3 28.9 25.2 23.5 6.8 19.9 °C/W AFS1500-FG256 X = 7.62; Y = 9.98 23.3 19.6 18.0 4.3 14.2 °C/W AFS600-FG484 X = 5.10; Y = 7.3 21.8 18.2 16.7 7.7 16.8 °C/W AFS1500-FG484 X = 7.62; Y = 9.98 21.6 16.8 15.2 5.6 14.9 °C/W AFS1500-FG676 TBD TBD TBD TBD TBD TBD °C/W θ JA TJ θA – P ------------------ = θ JB TJ TB – P ------------------- = θ JC TJ TC – P ------------------- = |
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