xlamp xB-D leD solDering & hanDling

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

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Copyright © 2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at

www.cree.com.

aSSemBly STorage & handling

Do not stack PCBs or assemblies containing XLamp XB-D LEDs so that anything rests on the LED lens. Force applied

to the LeD lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XB-D LeDs should be

stacked in a way to allow at least 2 cm clearance above the LeD lens.

Do not use bubble wrap directly on top of XLamp XB-D LEDs. Force from the bubble wrap can potentially damage the

LeD.

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