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SIP32413 Fiches technique(PDF) 11 Page - Vishay Siliconix |
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SIP32413 Fiches technique(HTML) 11 Page - Vishay Siliconix |
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11 / 12 page ![]() Document Number: 67493 www.vishay.com Revison: 07-Feb-11 1 Package Information Vishay Siliconix CASE OUTLINE FOR TDFN8 2 x 2 Note 1. All dimensions are in millimeters which will govern. 2. Max. package warpage is 0.05 mm. 3. Max. allowable burrs is 0.076 mm in all directions. 4. Pin #1 ID on top will be laser/ink marked. 5. Dimension applies to meatlized terminal and is measured between 0.20 mm and 0.25 mm from terminal tip. 6. Applied only for terminals. 7. Applied for exposed pad and terminals. Top View Side View Bottom View K K L D2 Pin 1 Indicator (Optional) 8 7 6 5 1 2 3 4 1 2 3 4 8 7 6 5 D A A3 A1 7 6 0.05 C Index Area (D/2 x E/2) MILLIMETERS INCHES DIM. MIN. NOM. MAX. MIN. NOM. MAX. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 - 0.05 0.000 - 0.002 A3 0.152 REF 0.006 REF b 0.18 0.23 0.28 0.007 0.009 0.011 D 1.95 2.00 2.05 0.077 0.079 0.081 D2 0.75 0.80 0.85 0.030 0.031 0.033 e 0.50 BSC 0.020 BSC E 1.95 2.00 2.05 0.077 0.079 0.081 E2 1.40 1.45 1.50 0.055 0.057 0.059 K - 0.20 - - 0.008 - L 0.30 0.35 0.40 0.012 0.014 0.016 ECN: C11-0033 Rev. A, 07-Feb-11 DWG: 5997 |
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