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ADP150ACBZ-1.8-R7 Fiches technique(PDF) 18 Page - Analog Devices |
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ADP150ACBZ-1.8-R7 Fiches technique(HTML) 18 Page - Analog Devices |
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18 / 20 page ![]() ADP150 Rev. A | Page 18 of 20 OUTLINE DIMENSIONS *COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS. 1.60 BSC 2.80 BSC 1.90 BSC 0.95 BSC 0.20 0.08 0.60 0.45 0.30 8° 4° 0° 0.50 0.30 0.10 MAX *1.00 MAX *0.90 MAX 0.70 MIN 2.90 BSC 5 4 1 2 3 SEATING PLANE Figure 49. 5-Lead Thin Small Outline Transistor Package [TSOT] (UJ-5) Dimensions show in millimeters 0.050 NOM COPLANARITY 0.800 0.760 SQ 0.720 0.230 0.200 0.170 0.280 0.260 0.240 0.660 0.600 0.540 0.430 0.400 0.370 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) A 1 2 B SEATING PLANE 0.40 BALL PITCH BALL A1 IDENTIFIER Figure 50.4-Ball Wafer Level Chip Scale Package [WLCSP] (CB-4-3) Dimensions show in millimeters |
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