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HMC772LC4 Fiches technique(PDF) 6 Page - Hittite Microwave Corporation

No de pièce HMC772LC4
Description  ACTIVE BIAS CONTROLLER
PDF  18 Pages
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Fabricant  HITTITE [Hittite Microwave Corporation]
Site Internet  http://www.hittite.com
Logo HITTITE - Hittite Microwave Corporation

HMC772LC4 Fiches technique(HTML) 6 Page - Hittite Microwave Corporation

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
13 - 6
13
Outline Drawing
Absolute Maximum Ratings [1]
VDD
12V
VG2_CONT, VDRAIN
-0.5V to VDD + 0.5V
SW, EN, CP_OUT, VGATEFB,
VNEGFB, TRIG_OUT, DISBL_SC,
ISENSE
-0.5V to VDIG + 0.5V
VDIG
5.5V
VNEG
-4V to GND
VG2
-0.5V to VDD + 0.5V
Junction Temperature
125 °C
Continuous Pdiss (T = 85 °C)
(Derate 19.19 mW/°C above 85 °C)
0.77 Watts
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Thermal Resistance (R
TH)
(Junction to package bottom)
52.1 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
ESD Sensitivity (HBM)
Class 1B
Note that there are two different voltage domains on HMC981; a
high voltage domain Vdd, and a low voltage domain VDIG. Take
necessary precautions not to violate ABS MAX ratings of each
subdomains.
HMC981
v00.0611
ACTIVE BIAS CONTROLLER
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. DIE THICKNESS IS 0.010 (0.254)
3. TYPICAL BOND PAD IS 0.0039 SQUARE
4. BOND PAD METALLIZATION: ALUMINUM
5. NO BACKSIDE METAL
6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
7. OVERALL DIE SIZE IS ±.002



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