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PCF8574P Fiches technique(PDF) 17 Page - NXP Semiconductors |
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PCF8574P Fiches technique(HTML) 17 Page - NXP Semiconductors |
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17 / 24 page ![]() 2002 Nov 22 17 Philips Semiconductors Product specification Remote 8-bit I/O expander for I2C-bus PCF8574 12 PACKAGE OUTLINES REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT38-4 92-11-17 95-01-14 MH c (e ) 1 ME A L A1 w M b1 b2 e D A2 Z 16 1 9 8 E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w ME e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.030 0.17 0.020 0.13 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 |
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