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LX432ISC Fiches technique(PDF) 2 Page - Microsemi Corporation |
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LX432ISC Fiches technique(HTML) 2 Page - Microsemi Corporation |
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2 / 10 page ![]() Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 Copyright © 2000 Rev. 1.3, 2005-02-24 LX432 Low Voltage Adjustable Precision Shunt Regulator PRODUCTION DATA SHEET TM ® ABSOLUTE MAXI MUM RATI NGS ( NOTE 1) Cathode to Anode Voltage (VKA)..................................................................-0.3V to +20V Reference Input Current (IREF) .....................................................................-50µA to 10µA Continuous Cathode Current (IK)............................................................... -25mA to 25mA Operating Junction Temperature................................................................................ 150°C Storage Temperature....................................................................................-65ºC to 150°C RoHS / Pb-free Peak Package Solder Reflow Temperature (40 second maximum exposure) ....................................................................260°C (+0,-5) Note 1: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. TH ERM A L DATA SC 3-Pin Plastic Package (PC Mounted) 220°C/W Thermal Resistance – Junction to Ambient, θJA (Non-PC Mounted) 410°C/W LP 3-Pin Plastic Package Thermal Resistance – Junction to Ambient, θJA 156°C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. PACKAGE PI N OUT ANODE REF CATHODE 1 2 3 SC PACKAGE – 3-PIN 3. CATHODE 2. ANODE 1. REF LP PACKAGE – 3-PIN RoHS / Pb-free 100% Matte Tin Lead Finish (All Views Top View) BLOCK DI AGRAM V REF Ref(R) Anode(A) Cathode (K) Figure 1 – Simplified Block Diagram |
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