TLE4254

Package Outlines

Data Sheet

18

Rev. 1.2, 2009-11-18

7

Package Outlines

Figure 8

Outline and footprint PG-DSO-8

Find all packages, sorts of packing and others at the Infineon Internet Page “Packages”:

http://www.infineon.com/packages.

Dimensions in mm

0.35 x 45˚

1)

-0.2

4

C

0.64

±0.2

6

±0.25

0.2

8x

M

C

1.27

+0.1

0.41

-0.06

B

8x

B

2)

Index Marking

1)

4

1

85

A

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Lead width can be 0.61 max. in dambar area

GPS01181

0.1

HLG05506

A

L

Reflow Soldering

Dimensions:

e = 1.27

A = 5.69

L = 1.31

B = 0.65