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IXFR64N60P Fiches technique(PDF) 1 Page - IXYS Corporation |
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IXFR64N60P Fiches technique(HTML) 1 Page - IXYS Corporation |
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1 / 5 page ![]() © 2006 IXYS All rights reserved DS99441E(01/06) PolarHVTM HiPerFET Power MOSFET V DSS = 600 V I D25 =36 A R DS(on) ≤≤≤≤≤ 105 m Ω Ω Ω Ω Ω t rr ≤≤≤≤≤ 200 ns N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode Symbol Test Conditions Characteristic Values (T J = 25° C, unless otherwise specified) Min. Typ. Max. BV DSS V GS = 0 V, ID = 3 mA 600 V V GS(th) V DS = VGS, ID = 8 mA 3.0 5.0 V I GSS V GS = ± 30 VDC, VDS = 0 ± 200 nA I DSS V DS = VDSS 25 µA V GS = 0 V T J = 125° C 1000 µA R DS(on) V GS = 10 V, ID = IT , Note 1 105 m Ω Symbol Test Conditions Maximum Ratings V DSS T J = 25 ° C to 150° C 600 V V DGR T J = 25 ° C to 150° C; R GS = 1 MΩ 600 V V GSS Continuous ± 30 V V GSM Transient ± 40 V I D25 T C = 25° C36 A I DM T C = 25° C, pulse width limited by TJM 150 A I AR T C = 25° C64 A E AR T C = 25° C80 mJ E AS T C = 25° C 3.5 J dv/dt I S ≤I DM, di/dt ≤100 A/µs, VDD ≤VDSS, 20 V/ns T J ≤150° C, R G = 2 Ω P D T C = 25° C 360 W T J -55 ... +150 °C T JM 150 °C T stg -55 ... +150 °C V ISOL 50/60 Hz, RMS, 1 minute 2500 V~ T L 1.6 mm (0.062 in.) from case for 10 s 300 ° C F C Mounting force 22..130/5..29 N/lb Weight ISOPLUS247 5 g G = Gate D = Drain S = Source ISOPLUS247 (IXFR) E153432 (Electrically Isolated Back Surface) Features l Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation l International standard packages l Unclamped Inductive Switching (UIS) rated l Low package inductance - easy to drive and to protect Advantages l Easy to mount l Space savings l High power density IXFR 64N60P Isolated back surface |
Numéro de pièce similaire - IXFR64N60P |
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Description similaire - IXFR64N60P |
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