PCF210AA datasheet(45/63 Pages) NXP

45 / 63 page

PCF2123

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Product data sheet

Rev. 5 — 27 April 2011

45 of 63

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

15. Package outline

Fig 30. Package outline SOT758-1 (HVQFN16) of PCF2123BS/1

terminal 1

index area

0.5

UNIT

0.2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

3.1

2.9

1.75

1.45

3.1

2.9

1.75

1.45

1.5

0.30

0.18

0.05

0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT758-1

MO-220

- - -

0.5

0.3

0.1

0.05

2.5

5 mm

scale

SOT758-1

HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;

16 terminals; body 3 x 3 x 0.85 mm

A(1)

max.

detail X

y1 C

02-03-25

02-10-21

terminal 1

index area

1/2

v M

w M

E(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D(1)

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