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MPC8306EC Fiches technique(PDF) 10 Page - Freescale Semiconductor, Inc |
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MPC8306EC Fiches technique(HTML) 10 Page - Freescale Semiconductor, Inc |
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10 / 76 page ![]() MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0 10 Freescale Semiconductor Power Characteristics Figure 3. MPC8306Power-Up Sequencing Example 3 Power Characteristics The typical power dissipation for this family of MPC8306 devices is shown in Table 5. Table 5. MPC8306 Power Dissipation Core Frequency (MHz) QUICC Engine Frequency (MHz) CSB Frequency (MHz) Typical Maximum Unit Notes 133 133 133 0.272 0.618 W 1, 2,3 200 200 133 0.291 0.631 W 1, 2, 3 266 200 133 0.451 0.925 W 1, 2, 3 Notes: 1. The values do not include I/O supply power (OVDD and GVDD), but it does include VDD and AVDD power . For I/O power values, see Table 6. 2. Typical power is based on a nominal voltage of VDD = 1.0 V, ambient temperature, and the core running a Dhrystone benchmark application. The measurements were taken on the evaluation board using WC process silicon. 3. Maximum power is based on a voltage of VDD = 1.05 V, WC process, a junction TJ = 105C, and an artificial smoke test. t 90% V Core Voltage (VDD) I/O Voltage (GVDD and OVDD) 0 0.7 V PORESET >= 32 tSYS_CLK_IN |
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