CPD66X datasheet(1/2 Pages) CENTRAL

No de pièce	CPD66X

Description	Low Leakage Diode Low Leakage Diode Chip

PDF	2 Pages

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Fabricant	CENTRAL [Central Semiconductor Corp]

Site Internet	http://www.centralsemi.com

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PROCESS CPD66X

Low Leakage Diode

Low Leakage Diode Chip

GEOMETRY

GROSS DIE PER 5 INCH WAFER

54,848

PRINCIPAL DEVICE TYPES

CMOD3003

CMLD3003DOG

CMPD3003A

CMPD3003C

CMPD3003S

PROCESS DETAILS

Die Size

17.5 x 17.5 MILS

Die Thickness

5.9 MILS

Anode Bonding Pad Area

7.9 MILS DIAMETER

Top Side Metalization

Al - 30,000Å

Back Side Metalization

Au-As - 13,000Å

www.centr a lsemi.com

R1 (19-July 2010)

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