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MPC5601DXLL Fiches technique(PDF) 25 Page - Freescale Semiconductor, Inc

No de pièce MPC5601DXLL
Description  Up to 256 KB on-chip Code Flash supported with Flash controller and ECC
PDF  77 Pages
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Fabricant  FREESCALE [Freescale Semiconductor, Inc]
Site Internet  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC5601DXLL Fiches technique(HTML) 25 Page - Freescale Semiconductor, Inc

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Electrical characteristics
MPC5602D Microcontroller Data Sheet, Rev. 3.1
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
25
4.6.2
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:
TJ = TA + (PD x RJA)
Eqn. 1
Where:
TA is the ambient temperature in °C.
RJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PI/O (PD = PINT + PI/O).
PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power.
PI/O represents the power dissipation on input and output pins; user determined.
Most of the time for the applications, PI/O< PINT and may be neglected. On the other hand, PI/O may be significant, if the device
is configured to continuously drive external modules and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273 °C)
Eqn. 2
Therefore, solving equations 1 and 2:
K = PD x (TA + 273 °C) + RJA x PD
2
Eqn. 3
Where:
K is a constant for the particular part, which may be determined from Equation 3 by measuring PD (at equilibrium)
for a known TA. Using this value of K, the values of PD and TJ may be obtained by solving equations 1 and 2
iteratively for any value of TA.
4.7
I/O pad electrical characteristics
4.7.1
I/O pad types
The device provides four main I/O pad types depending on the associated alternate functions:
•
Slow pads—These pads are the most common pads, providing a good compromise between transition time and low
electromagnetic emission.
•
Medium pads—These pads provide transition fast enough for the serial communication channels with controlled
current to reduce electromagnetic emission.
•
Input only pads—These pads are associated to ADC channels (ADC_P[X]) providing low input leakage.
Medium pads can use slow configuration to reduce electromagnetic emission except for PC[1], that is medium only, at the cost
of reducing AC performance.



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