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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MPC8544E Fiches technique(PDF) 81 Page - Freescale Semiconductor, Inc |
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MPC8544E Fiches technique(HTML) 81 Page - Freescale Semiconductor, Inc |
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81 / 117 page  MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5 Freescale Semiconductor 81 Package Description 18 Package Description This section details package parameters, pin assignments, and dimensions. 18.1 Package Parameters for the MPC8544E FC-PBGA The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in Table 61. Table 61. Package Parameters Parameter PBGA1 Package outline 29 mm × 29 mm Interconnects 783 Ball pitch 1 mm Ball diameter (typical) 0.6 mm Solder ball (Pb-free) 96.5% Sn 3.5% Ag Note: 1. (FC-PBGA) without a lid. |
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