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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MPC8358E Fiches technique(PDF) 65 Page - Freescale Semiconductor, Inc |
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MPC8358E Fiches technique(HTML) 65 Page - Freescale Semiconductor, Inc |
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65 / 95 page  MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3 Freescale Semiconductor 65 Package and Pin Listings 21 Package and Pin Listings This section details package parameters, pin assignments, and dimensions. The MPC8358E is available in a plastic ball grid array (PBGA), see Section 21.1, “Package Parameters for the PBGA Package,” and Section 21.2, “Mechanical Dimensions of the PBGA Package,” for information on the package. 21.1 Package Parameters for the PBGA Package The package parameters for rev 2.0 silicon are as provided in the following list. The package type is 29 mm x 29 mm, 668 plastic ball grid array (PBGA). Package outline 29 mm x 29 mm Interconnects 668 Pitch 1.00 mm Module height (typical) 1.46 mm Solder Balls 62 Sn/36 Pb/2 Ag (ZQ package) 95.5 Sn/0.5 Cu/4Ag (VR package) Ball diameter (typical) 0.64 mm |
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