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AP1530 Fiches technique(PDF) 9 Page - Diodes Incorporated |
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AP1530 Fiches technique(HTML) 9 Page - Diodes Incorporated |
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9 / 12 page ![]() AP1530 18V 3A 300KHz BUCK CONVERTER AP1530 Rev. 7 9 of 12 NOVEMBER 2009 DS31092 www.diodes.com © Diodes Incorporated Top Side Layout Guide Bottom Side Layout Guide Functional Description (Continued) Use vias to conduct the heat into the backside of PCB layer. The heat sink at output (SW) pins should be allowed for maximum solder-painted area. Keep the gap of exposed pads from short circuit. Recommended exposed-pads gap: 30~40mil (0.75~1mm) Brown: IC exposed pads. Red: recommended layout. Reference pads layout dimension: Output: 90 x 50 mil Vss: 90 x 60 mil |
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