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STTH110 Fiches technique(PDF) 3 Page - STMicroelectronics

No de pièce STTH110
Description  High voltage ultrafast rectifier
PDF  6 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STTH110 Fiches technique(HTML) 3 Page - STMicroelectronics

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STTH110
Characteristics
Doc ID 9344 Rev 2
3/6
Figure 1.
Conduction losses versus average
current
Figure 2.
Forward voltage drop versus
forward current
P(W)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
I
(A)
F(AV)
δ = 1
δ = 0.05
δ = 0.5
δ = 0.2
δ = 0.1
T
δ=tp/T
tp
I
(A)
FM
0.1
1.0
10.0
100.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
V
(V)
FM
T =25°C
(maximum values)
j
T =150°C
(maximum values)
j
T =150°C
(typical values)
j
Figure 3.
Relative variation of thermal
impedance junction ambient versus
pulse duration (DO-41)
Figure 4.
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA)
Z/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
t (s)
p
T
δ=tp/T
tp
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
epoxy FR4, leads = 10 mm
Z/R
th(j-c)
th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
t (s)
p
T
δ=tp/T
tp
δ = 0.5
δ = 0.2
δ = 0.1
Single pulse
Figure 5.
Thermal resistance junction to
ambient versus copper surface
under each lead (DO-41)
Figure 6.
Thermal resistance junction to
ambient versus copper surface
under each lead (SMA).
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
012
34567
89
10
S(cm²)
epoxy printed circuit board FR4, copper thickness: 35 µm
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
S(cm²)
epoxy printed circuit board FR4, copper thickness: 35 µm



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