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IP2005APBF Fiches technique(PDF) 17 Page - International Rectifier |
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IP2005APBF Fiches technique(HTML) 17 Page - International Rectifier |
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17 / 18 page ![]() PD-60325 iP2005APbF Recommended Solder Paste Stencil Design Notes: 1.This view is stencil squeegee view 2.Dimensions are shown in millimeters 3.This opening is based on using 150 micron thick stencil. If using a different thickness stencil, this opening needs to be adjusted accordingly. 4.Dashed lines show stencil openings. Solid lines show PCB pad openings. 5.The recommended reflow peak temperature is 260ºC. The total furnace time is approximately 5 minutes with approximately 10 seconds at peak temperature. CORNER ID Figure 16 Solder Paste Stencil Design Part Marking Figure 17 Part Marking www.irf.com 2/8/2008 17 |
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