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M24M01-R Fiches technique(PDF) 30 Page - STMicroelectronics |
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M24M01-R Fiches technique(HTML) 30 Page - STMicroelectronics |
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30 / 37 page ![]() M24M01-R die description M24M01-R, M24M01-W, M24M01-HR 30/37 Doc ID 12943 Rev 7 8 M24M01-R die description Caution: As EEPROM cells loose their charge (and so their binary value) when exposed to ultra violet (UV) light, EEPROM dice delivered in wafer form by STMicroelectronics must never be exposed to UV light. Product M24M01-A ● Wafer size 203 mm (8 inches) ● Die identification M24M01, processed in the Rousset fab Die Layout ● Die size (X × Y) 2085 × 3605 µm (including scribe line) ● Scribe line 80.0 × 80.0 µm ● Pad opening 90 × 90 µm ● DI Die identification (at the position shown in Figure 17) ● Pads Pad contacts (at the positions shown in Figure 17 and Table 18) Figure 17. M24M01-R die plot 1. Refer to Table 18: Pad coordinates for the pad locations. Die identification: M24M01 VCC WC SCL SDA E1 E2 VSS E0 Y X ai15446 |
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