ST7LNB1Y0 datasheet(33/36 Pages) STMICROELECTRONICS

33 / 36 page

ST7LNB1Y0

Package characteristics

33/36

6.2

Thermal characteristics

6.3

Soldering information

In order to meet environmental requirements, ST offers the ST7LNB1Y0 in ECOPACK®

package. The package have a Lead-free second level interconnect. The category of second

Level Interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com,

together with specific technical application notes covering the main technical aspects

related to lead-free conversion (AN2033, AN2034, AN2035, AN2036).

Backward and forward compatibility

The main difference between Pb and Pb-free soldering process is the temperature range.

●

ECOPACK LQFP, SDIP, SO and QFN20 packages are fully compatible with Lead (Pb)

containing soldering process (see application note AN2034)

●

TQFP, SDIP and SO Pb-packages are compatible with Lead-free soldering process,

nevertheless it's the customer's duty to verify that the Pb-packages maximum

temperature (mentioned on the Inner box label) is compatible with their Lead-free

soldering temperature.

Table 33.

Thermal characteristics

Symbol

Ratings

Value

Unit

RthJA

Package thermal resistance

(junction to ambient)

SO16

°C/W

TJmax

Maximum junction temperature(1)

The maximum chip-junction temperature is based on technology characteristics.

150

°C

PDmax

Power dissipation(2)

The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.

The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip

internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application.

SO16

300

Table 34.

Soldering compatibility (wave and reflow soldering process)

Package

Plating material devices

Pb solder paste

Pb-free solder paste

SDIP & PDIP

Sn (pure Tin)

Yes

Yes (1)

Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is

compatible with their Lead-free soldering process.

QFN

Sn (pure Tin)

Yes

Yes(1)

LQFP and SO

NiPdAu (Nickel-palladium-Gold)

Yes

Yes(1)

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