MCP14628 datasheet(8/24 Pages) MICROCHIP

8 / 24 page

MCP14628

DS22083A-page 8

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE .

3.1

High-side Gate Driver Pin

(HIGHDR)

The HIGHDR pin provides the gate drive signal to

control the high-side power MOSFET. The gate of the

high-side power MOSFET is connected to this pin.

3.2

Floating Bootstrap Supply Pin

(BOOT)

The BOOT pin is the floating bootstrap supply pin for

the high-side gate drive. A capacitor is connected

between this pin and the PHASE pin to provide the

necessary charge to turn on the high-side power MOS-

FET.

3.3

PWM Input Control Pin (PWM)

The control input signal is supplied to the PWM pin.

This tri-state pin controls the state of the HIGHDR and

LOWDR pins. Placing a voltage equal to VCC/2 on this

pin causes both the HIGHDR and LOWDR to a low

state.

3.4

Ground Pin (GND)

The GND pin provides ground for the MCP14628 cir-

cuitry. It should have a low impedance connection to

the bias supply source return. High peak currents will

flow out the GND pin when the low-side power

MOSFET is being turned off.

3.5

Low-side Gate Driver Pin

(LOWDR)

The LOWDR pin provides the gate drive signal to

control the low-side power MOSFET. The gate of the

low-side power MOSFET is connected to this pin.

3.6

Supply Input Voltage Pin (VCC)

The VCC pin provides bias to the MCP14628. A bypass

capacitor is to be placed between this pin and the GND

pin. This capacitor should be placed as close to the

MCP14628 as possible.

3.7

Forced Continuous Conduction

Mode Pin (FCCM)

The FCCM pin enables or disables the forced

continuous conduction mode. With the FCCM pin con-

nected to ground the MCP14628 enters a diode emula-

tion mode to improve system efficiency at light loads.

Continuous conduction is forced if the FCCM pin is

connected to VCC.

3.8

Switch Node Pin (PHASE)

The PHASE pin provides the return path for the high-

side gate driver. The source of the high-side power

MOSFET is connected to this pin.

3.9

DFN Exposed Pad

The exposed metal pad of the DFN package is not

internally connected to any potential. Therefore, this

pad can be connected to a ground plane or other

copper plane on a printed circuit board to aid in heat

removal from the package.

SOIC

3x3 DFN

Symbol

Description

HIGHDR

High-side Gate Driver Pin

BOOT

Floating Bootstrap Supply Pin

PWM

PWM Input Control Pin

GND

Ground

LOWDR

Low-side Gate Driver Pin

VCC

Supply Input Voltage

FCCM

Forced Continuous Conduction Mode Pin

PHASE

Switch Node Pin

—

PAD

Exposed Metal Pad

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