ADP2302ARDZ-3.3-R7 datasheet(5/28 Pages) AD

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ADP2302/ADP2303

Rev. 0 | Page 5 of 28

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

BST

VIN

PGOOD 4

GND

NOTES

1. NC = NO CONNECT.

2. THE EXPOSED PAD SHOULD BE SOLDERED

TO AN EXTERNAL GROUND PLANE UNDERNEATH

THE IC FOR THERMAL DISSIPATION.

ADP2302

ADP2303

TOP VIEW

(Not to Scale)

Figure 3. Pin Configuration (Top View)

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

BST

Bootstrap Supply for the High-Side MOSFET Driver. A 0.1 μF capacitor is connected between SW and BST to

provide a floating driver voltage for the power switch.

VIN

Power Input. Connect to the input power source with a ceramic bypass capacitor to GND directly from this

pin.

Output Enable. Pull this pin high to enable the output. Pull this pin low to disable the output. This pin can

also be used as a programmable UVLO input. This pin has an internal 1.2 μA pull-down current to GND.

PGOOD

Power-Good Open-Drain Output.

Feedback Voltage Sense Input. For the adjustable version, connect this pin to a resistive divider from VOUT. For

the fixed output version, connect this pin to VOUT directly.

Used for internal testing. Connect to GND or leave this pin floating to ensure proper operation.

GND

Ground. Connect this pin to the ground plane.

Switch Node Output. Connect an inductor to VOUT and a catch diode to GND from this pin.

9 (EPAD)

Exposed Pad

The exposed pad should be soldered to an external ground plane underneath the IC for thermal dissipation.

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