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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ADP320 Fiches technique(PDF) 19 Page - Analog Devices |
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ADP320 Fiches technique(HTML) 19 Page - Analog Devices |
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19 / 20 page  ADP320 Rev. 0 | Page 19 of 20 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP320 triple LDO. However, as can be seen from Table 6, a point of diminishing returns eventually is reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VINx and GND pins. Place the output capacitors as close as possible to the VOUTx and GND pins. Use 0402 or 0603 size capacitors and resistors to achieve the smallest possible footprint solution on boards where area is limited. Figure 51. Example of PCB Layout, Top Side Figure 52. Example of PCB Layout, Bottom Side |
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