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AD9550/PCBZ Fiches technique(PDF) 18 Page - Analog Devices |
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AD9550/PCBZ Fiches technique(HTML) 18 Page - Analog Devices |
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18 / 20 page ![]() AD9550 Rev. 0 | Page 18 of 20 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-WHHD. 1 0.50 BSC BOTTOM VIEW TOP VIEW PIN 1 INDICATOR 32 9 16 17 24 25 8 EXPOSED PAD PIN 1 INDICATOR 3.25 3.10 SQ 2.95 SEATING PLANE 0.05 MAX 0.02 NOM 0.20 REF COPLANARITY 0.08 0.30 0.25 0.18 5.10 5.00 SQ 4.90 0.80 0.75 0.70 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.50 0.40 0.30 0.25 MIN Figure 27. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very, Very Thin Quad (CP-32-7) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD9550BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 AD9550BCPZ-REEL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-32-7 AD9550/PCBZ Evaluation Board 1 Z = RoHS Compliant Part. |
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