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BA6569AFP Fiches technique(PDF) 9 Page - Rohm |
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BA6569AFP Fiches technique(HTML) 9 Page - Rohm |
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9 / 12 page ![]() 234 Communication ICs BA6569AS / BA6569AFP FOperation notes The maximum power dissipation for the BA6569AS is 1100mW, and for the BA6569AFP, the maximum power dissipation is 1200mW (when mounted on 90mm 50mm 1.6mm glass epoxy boards, however, fins should be soldered to the foil pattern). Since the maxi- mum power dissipation varies with temperature, the product of the applied voltage VL and the total current drawn by the IC, after factoring in the temperature, should not exceed the maximum dissipation. |
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