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MF1S5009DA4 Fiches technique(PDF) 3 Page - NXP Semiconductors |
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MF1S5009DA4 Fiches technique(HTML) 3 Page - NXP Semiconductors |
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3 / 32 page ![]() MF1S5009 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3 — 27 July 2010 189131 3 of 32 NXP Semiconductors MF1S5009 Mainstream contactless smart card IC 3. Applications Public transportation Access management Electronic toll collection Car parking School and campus cards Employee cards Internet cafés Loyalty 4. Ordering information 5. Block diagram Table 1. Ordering information Type number Package Commerci al Name Name Description Version MF1S5009DUD FFC - 8 inch wafer, 120 μm thickness, on film frame carrier, electronic fail die marking according to SECS-II format) - MF1S5009DA4 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide tape SOT500-2 Fig 2. Block diagram 001aal732 RF INTERFACE UART ISO/IEC 14443A LOGIC UNIT CRC EEPROM CRYPTO1 POWER ON RESET VOLTAGE REGULATOR CLOCK INPUT FILTER RESET GENERATOR |
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