Soldering directions

1

Terminations

1.1

Nickel barrier termination

The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-

allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-

vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-

rier termination is suitable for all commonly-used soldering methods.

Multilayer CTVS: Structure of nickel barrier termination

1.2

Silver-palladium termination

Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-

tended for conductive adhesion. This metallization improves the resistance of large chips to ther-

mal shock.

In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-

sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-

cations as well. The silver-palladium termination is not approved for lead-free soldering.

Multilayer varistor: Structure of silver-palladium termination

SMD disk varistors (CU varistors)

Automotive series

Page 13 of 28

Please read Cautions and warnings and

Important notes at the end of this document.