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TOP209P Fiches technique(PDF) 15 Page - Power Integrations, Inc. |
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TOP209P Fiches technique(HTML) 15 Page - Power Integrations, Inc. |
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15 / 16 page ![]() A 8/97 TOP209/210 15 PI-2076-041101 1 A K J1 4 L G 85 C N P08A DIP-8 D S .004 (.10) J2 -E- -D- B -F- DIM A B C G H J1 J2 K L M N P Q inches 0.370-0.385 0.245-0.255 0.125-0.135 0.015-0.040 0.120-0.135 0.060 (NOM) 0.014-0.022 0.010-0.012 0.090-0.110 0.030 (MIN) 0.300-0.320 0.300-0.390 0.300 BSC mm 9.40-9.78 6.22-6.48 3.18-3.43 0.38-1.02 3.05-3.43 1.52 (NOM) 0.36-0.56 0.25-0.30 2.29-2.79 0.76 (MIN) 7.62-8.13 7.62-9.91 7.62 BSC Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB for standard dual in-line (DIP) package .300 inch row spacing (PLASTIC) 8 leads (issue B, 7/85).. 2. Controlling dimensions are inches. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. D, E and F are reference datums on the molded body. H M P Q PI-2077-042601 1 A J1 4 L 85 C G08A SMD-8 D S .004 (.10) J2 -E- -D- B -F- M J3 DIM A B C G H J1 J2 J3 J4 K L M P α inches 0.370-0.385 0.245-0.255 0.125-0.135 0.004-0.012 0.036-0.044 0.060 (NOM) 0.048-0.053 0.032-0.037 0.007-0.011 0.010-0.012 0.100 BSC 0.030 (MIN) 0.372-0.388 0-8 ° mm 9.40-9.78 6.22-6.48 3.18-3.43 0.10-0.30 0.91-1.12 1.52 (NOM) 1.22-1.35 0.81-0.94 0.18-0.28 0.25-0.30 2.54 BSC 0.76 (MIN) 9.45-9.86 0-8 ° Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (issue B, 7/85) except for lead shape and size. 2. Controlling dimensions are inches. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. D, E and F are reference datums on the molded body. K G α H .004 (.10) J4 P .010 (.25) M A S Heat Sink is 2 oz. Copper As Big As Possible .420 .046 .060 .060 .046 .080 Pin 1 .086 .186 .286 Solder Pad Dimensions |
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