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MCP2003-E/MD Fiches technique(PDF) 14 Page - Microchip Technology

No de pièce MCP2003-E/MD
Description  LIN J2602 Transceiver
PDF  32 Pages
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Fabricant  MICROCHIP [Microchip Technology]
Site Internet  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP2003-E/MD Fiches technique(HTML) 14 Page - Microchip Technology

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MCP2003/4
DS22230A-page 14
 2010 Microchip Technology Inc.
2.3
AC Specifications
AC CHARACTERISTICS
VBB = 6.0V to 27.0V; TA = -40°C to +125°C
Parameter
Sym
Min.
Typ.
Max.
Units
Test Conditions
Bus Interface – Constant Slope Time Parameters
Slope rising and falling
edges
tslope
3.5
22.5
µs
7.3V <= VBB <= 18V
Propagation Delay of
Transmitter
ttranspd
4.0
µs
ttranspd = max (ttranspdr or ttranspdf)
Propagation Delay of
Receiver
trecpd
6.0
µs
trecpd = max (trecpdr or trecpdf)
Symmetry of Propagation
Delay of Receiver rising
edge w.r.t. falling edge
trecsym
-2.0
2.0
µs
trecsym = max (trecpdf – trecpdr)
Symmetry of Propagation
Delay of Transmitter rising
edge w.r.t. falling edge
ttrans-
sym
-2.0
2.0
µs
ttranssym = max (ttranspdf - ttranspdr)
Time to sample of FAULT/
TXE for bus conflict reporting
tfault
32.5
µs
tfault = max (ttranspd + tslope + trecpd)
Duty Cycle 1 @20.0 kbit/sec
39.6
%tbit
Cbus;Rbus conditions:
1 nF; 1 kW | 6.8 nF; 660W | 10 nF; 500W
THrec(max) = 0.744 x VBB,
THdom(max) = 0.581 x VBB,
VBB =7.0V-18V; tbit = 50 µs
D1 = tbus_rec(min) / 2 x tbit)
Duty Cycle 2 @20.0 kbit/sec
58.1
%tbit
Cbus;Rbus conditions:
1 nF; 1 kW | 6.8 nF; 660W | 10 nF; 500W
THrec(max) = 0.284 x VBB,
THdom(max) = 0.422 x VBB,
VBB =7.6V-18V; tbit = 50 µs
D2 = tbus_rec(max) / 2 x tbit)
Duty Cycle 3 @10.4 kbit/sec
41.7
%tbit
Cbus;Rbus conditions:
1 nF; 1 kW | 6.8 nF; 660W | 10 nF; 500W
THrec(max) = 0.778 x VBB,
THdom(max) = 0.616 x VBB,
VBB =7.0V-18V; tbit = 96 µs
D3 = tbus_rec(min) / 2 x tbit)
Duty Cycle 4 @10.4 kbit/sec
59.0
%tbit
Cbus;Rbus conditions:
1 nF; 1 kW | 6.8 nF; 660W | 10 nF; 500W
THrec(max) = 0.251 x VBB,
THdom(max) = 0.389 x VBB,
VBB =7.6V-18V; tbit = 96 µs
D4 = tbus_rec(max) / 2 x tbit)
Wake-up Timing
Bus Activity Debounce time
tBDB
5
20
µs
Bus debounce time, 10 µs typical
Bus Activity to Vren on
tBACTVE
35
150
µs
After Bus debounce time, 52 µs typical
WAKE to Vren on
tWAKE
150
µs
Chip Select to Vren on
tCSOR
150
µs
Vren floating
Chip Select to Vren off
tCSPD
80
µs
Vren floating



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