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RB751CS40 Fiches technique(PDF) 6 Page - NXP Semiconductors |
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RB751CS40 Fiches technique(HTML) 6 Page - NXP Semiconductors |
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6 / 10 page ![]() RB751_SER_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 21 May 2007 6 of 10 NXP Semiconductors RB751 series Schottky barrier single diodes 10. Soldering Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD882 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 8. Reflow soldering footprint SOD523 (SC-79) mbl872 1.30 0.30 R = 0.05 (8 ×) R = 0.05 (8 ×) 0.60 (2 ×) 0.70 (2 ×) 0.80 (2 ×) 0.90 0.30 (2 ×) 0.40 (2 ×) 0.50 (2 ×) solder lands solder resist occupied area solder paste mgs343 1.80 1.90 0.30 0.40 0.50 1.20 0.60 2.15 solder lands solder resist occupied area solder paste |
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