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ADP172ACBZ-1.0-R7 Fiches technique(PDF) 15 Page - Analog Devices

No de pièce ADP172ACBZ-1.0-R7
Description  300 mA, Low Quiescent Current CMOS Linear Regulator
PDF  20 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

ADP172ACBZ-1.0-R7 Fiches technique(HTML) 15 Page - Analog Devices

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ADP172
Rev. B | Page 15 of 20
0
20
40
60
80
100
120
140
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
VIN – VOUT (V)
ILOAD = 300mA
TJ MAX
ILOAD = 1mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 10mA
Figure 31. 100 mm2 of PCB Copper, TA = 25°C
0
20
40
60
80
100
120
140
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
VIN – VOUT (V)
ILOAD = 300mA
TJ MAX
ILOAD = 1mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 10mA
Figure 32. 0 mm2 of PCB Copper, TA = 25°C
0
20
40
60
80
100
120
140
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
VIN – VOUT (V)
ILOAD = 300mA
TJ MAX
ILOAD = 1mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 10mA
Figure 33. 500 mm2 of PCB Copper, TA = 50°C
0
20
40
60
80
100
120
140
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
VIN – VOUT (V)
ILOAD = 300mA
TJ MAX
ILOAD = 1mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 10mA
Figure 34. 100 mm2 of PCB Copper, TA = 50°C
0
20
40
60
80
100
120
140
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
VIN – VOUT (V)
ILOAD = 300mA
TJ MAX
ILOAD = 1mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 10mA
Figure 35. 0 mm2 of PCB Copper, TA = 50°C
In cases where board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction tem-
perature rise (see Figure 36). Maximum junction temperature
(TJ) is calculated from the board temperature (TB) and power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 58°C/W for the 4-Ball WLCSP package.
0
20
40
60
80
100
120
140
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
VIN – VOUT (V)
ILOAD = 300mA
TJ MAX
ILOAD = 1mA
ILOAD = 50mA
ILOAD = 100mA
ILOAD = 200mA
ILOAD = 10mA
Figure 36. TA = 85°C



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