PCF8564AUSLASH5BBSLASH1 datasheet(25/44 Pages) NXP

25 / 44 page

PCF8564A_1

Product data sheet

Rev. 1 — 8 October 2009

25 of 44

NXP Semiconductors

PCF8564A

Real time clock and calendar

11. Internal circuitry

12. Limiting values

[1]

Pass level; Human Body Model (HBM) according to Ref. 6 “JESD22-A114”.

[2]

Pass level; Machine Model (MM), according to Ref. 7 “JESD22-A115”.

[3]

Pass level; latch-up testing, according to Ref. 8 “JESD78” at maximum ambient temperature

(Tamb(max) = +85 °C).

[4]

According to the NXP store and transport conditions (see Ref. 10 “SNW-SQ-623”) the devices have to be

stored at a temperature of +5

°C to +45 °C and a humidity of 25 % to 75 %.

Fig 20. Device diode protection diagram

013aaa035

SDA

SCL

VDD

CLKOE

OSCI

OSCO

VSS

PCF8564A

INT

CLKOUT

Table 28.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter

Conditions

Min

Max

Unit

VDD

supply voltage

−0.5

+6.5

input voltage

−0.5

+6.5

output voltage

−0.5

+6.5

IDD

supply current

−50.0

+50.0

input current

−10.0

+10.0

output current

−10.0

+10.0

ISS

ground supply current

−50.0

+50.0

Ptot

total power dissipation

300

Tamb

ambient temperature

−40.0

+85

°C

VESD

electrostatic discharge voltage

HBM

[1]

die type 1 and 3

±2500

die type 2

±3500

[2]

die type 1 and 3

±200

die type 2

±250

Ilu

latch-up current

all pins but OSCI

[3] -

100

Tstg

storage temperature

[4]

−65.0

+150

°C

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