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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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09HSI-S043-R0-CHT Fiches technique(PDF) 21 Page - Hirose Electric |
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09HSI-S043-R0-CHT Fiches technique(HTML) 21 Page - Hirose Electric |
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21 / 71 page  Signal Integrity Report – IT3 (25mm) Page 21 Figure 31 ICR profile of FEXT for pair 8 of via+connector+via transition with routing on layer 16 The ICR profile for NEXT is not as critical since the TX and RX wafers can be grouped separately. The ICR profile for FEXT satisfies the IEEE 802.3ap spec up to 16GHz. For further improvement of the ICR profile, skipped pins can be applied. 3.1.3.2 50% density pin assignment Figure 32 SDD for pair 4 of cascaded via+connector+via transition with routing on layer 16 for 50% pin density configuration |
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