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74LVC1G07GF Fiches technique(PDF) 2 Page - NXP Semiconductors |
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74LVC1G07GF Fiches technique(HTML) 2 Page - NXP Semiconductors |
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2 / 14 page ![]() 74LVC1G07_8 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 08 — 17 July 2007 2 of 14 NXP Semiconductors 74LVC1G07 Buffer with open-drain output 3. Ordering information 4. Marking 5. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74LVC1G07GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74LVC1G07GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 74LVC1G07GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1.45 × 0.5 mm SOT886 74LVC1G07GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1 × 0.5 mm SOT891 Table 2. Marking Type number Marking code 74LVC1G07GW VS 74LVC1G07GV V07 74LVC1G07GM VS 74LVC1G07GF VS Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram mna623 AY 2 4 mna624 4 2 A Y mna591 Y A GND |
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