| Moteur de recherche de fiches techniques de composants électroniques |
|
ADMP404ACEZ Fiches technique(PDF) 8 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADMP404ACEZ Fiches technique(HTML) 8 Page - Analog Devices |
|
8 / 12 page ![]() ADMP404 Preliminary Technical Data Rev. PrH | Page 8 of 12 PCB LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP404 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 9. Care should be taken to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 10. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. Ø1.55 Ø0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 Figure 9. PCB Land Pattern Layout 1.22 2× 0.8 × 0.6 0.2 × 45 TYP 1.52mm 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) Figure 10. Suggested Solder Paste Stencil Pattern Layout |
|
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |