Production Data

WM2613

WOLFSON MICROELECTRONICS LTD

Production Data Rev 1.0 June 1999

11

PACKAGE DIMENSIONS

θθ

c

L

GAUGE

PLANE

0.25

NOTES:

A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.

B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM.

D. MEETS JEDEC.95 MO-153, VARIATION = AC. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.

DM008.C

DT: 20 PIN TSSOP (6.5 x 4.4 x 1.0 mm)

Symbols

Dimensions

(mm)

MIN

NOM

MAX

A

-----

-----

1.20

0.05

-----

0.15

0.80

1.00

1.05

b

0.19

-----

0.30

c

0.09

-----

0.20

D

6.40

6.50

6.60

e

0.65 BSC

E

6.4 BSC

4.30

4.40

4.50

L

0.45

0.60

0.75

θθ

0

o

-----

8

o

REF:

JEDEC.95, MO-153

A

A2

A1

SEATING PLANE

-C-

0.05 C

11

20

E1

E

e

b

10

1

D