| Moteur de recherche de fiches techniques de composants électroniques |
|
STIEC45-26AS Fiches technique(PDF) 5 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STIEC45-26AS Fiches technique(HTML) 5 Page - STMicroelectronics |
|
5 / 9 page ![]() STIEC45-XXAS Characteristics Doc ID 16871 Rev 1 5/9 Figure 9. Leakage current versus junction temperature (typical values) Figure 7. Relative variation of thermal impedance, junction to ambient, versus pulse duration Figure 8. Thermal resistance junction to ambient versus copper surface under each lead Z th(j a) /Rth(j a) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Single pulse tP(s) Recommended pad layout PCB FR4, copper thickness = 35 µm 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCU(cm²) PCB FR4, copper thickness = 35 µm R (°C/W) th(j-a) IR (nA) 1.E+00 1.E+01 1.E+02 1.E+03 25 50 75 100 125 150 V R=VRM Tj(°C) |
|
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |